Cleaning the underside in the stencil printer
Solvent-based, ready-to-use ETIMOL
| Appearance: | Colorless to slightly yellowish, clear liquid |
| Form of application: | ready for use |
| ph-value: | Neutral |
| Density at 20 °C: | 0.821 +/- 0.005 g/cm³ |
| Boiling point/boiling range: | 170 - 210 °C |
| System: | Solvent mixture |
| Flash point: | 63 °C |
| Application temperature: | Room temperature |
| Cleans reliably: | Lead-containing, lead-free, no-clean solder pastes, SMT adhesives |
| Storage conditions: | in the sealed original container at 10 - 25 °C |
| Hazardous goods: | no |
| Durability: | 36 months (after date of manufacturing) |
The solvent-based, pH-neutral cleaning medium efficiently removes residues of leaded, lead-free or so-called no-clean solder pastes as well as SMT adhesives from the underside of the stencil. After the printing process, Etimol SUC 63 RSN optimally wets both the cleaning roller or cleaning fleece and the stencil side, so that consistently high and qualitatively reproducible cleaning results are achieved. The mild odor formulation combines good cleaning properties with optimum drying properties. This significantly minimizes the smearing of solder paste particles on the underside of the stencil.
Instructions for use:
Depending on the printer model and manufacturer, the cleaning medium is either poured undiluted directly into the supply tank of the stencil printer at room temperature or drawn directly from the delivery container.
Note:
Observe the machine manufacturer's approvals!
