Wave and selective soldering, dip soldering process
No Clean-Flux, alcohol-based
Di-carboxylic acid complex, synthetic resin, haogenlide-free (WEEE/RoHS-compliant)
Type ISO-9454: 1231 // DIN EN 61190-1-1: (acc. to J-STD 004): [IPC: REL0]
| Appearance: | colourless to reddish, clear liquid |
| Solids content: | 1.9 - 2.1 wt.-% |
| Acid value: | 16 - 19 mg KOH/g |
| Density at 20 °C: | 0.793 (+/- 0.003) g/ml |
| Activators: | halogenide-free resin-based di-carboxylic acid complex, synthetic resin |
| Solvent: | short chain alcohols |
| VOC: | 98 % |
| Flash point: | 12 °C |
| Durability: | 24 months |
| Storage: | store at 5 - 25 °C, cool and dry, originally sealed |
| Processing temperature: | at room temperature (usually 20 - 25 °C) |
EO-B-008A is a 21TP3 high performance No Clean-Flux based on alcohol with di-carboxylic acids and synthetic resin. This flux was developed for wave soldering and dip soldering processes. This variant was specially developed for full tunnel nitrogen applications and guarantees significantly better soldering results than conventional adipic acid solutions under full nitrogen thanks to a wide process window and high temperature stability.
It can be applied using all standard application methods (except foaming). EO-B-008A is classified as a "non-corrosive" flux.
Information on the ingredients (hazardous substances), safe handling, storage, transportation and disposal can be found in the current safety data sheet (SDS, SDS, MSDS).
Recommendation from practice:
This flux is very versatile, with good results in wave soldering and special applications. The generally applicable rule that the amount of flux applied should always be as low as possible also applies to this product.
Spray fluxes: When dosing, the amount of flux initially to 30 – 50 ml / min. Adjust the uniform flux distribution on the printed circuit board (if necessary test with thermal paper) and then correct to the optimum amount.
Preheating: For “simple” PCBs, a preheat temperature of 80 – 110 °C, recommended for “more complex” boards from 100 – 130 °C on the top side of the PCB. The use can be made both in leaded and lead-free solder systems.
