Wave and selective soldering, dip soldering and strand tinning
No Clean-Flux, alcohol-based
Di-carboxylic acid complex, synthetic resin, halide-free (WEEE/RoHS compliant)
Type ISO-9454: 1231 // DIN EN 61190-1-1: (acc. to J-STD 004): [IPC: REL0]
| Appearance: | colourless to reddish, clear liquid |
| Solids content: | 2.9 - 3.2 wt.-% |
| Acid value: | 23 - 27 mg KOH/g |
| Density at 20 °C: | 0.795 (+/- 0.003) g/ml |
| Activators: | halogenide-free resin-based di-carboxylic acid complex, synthetic resin |
| Solvent: | short chain alcohols |
| VOC: | 97 % |
| Flash point: | 12 °C |
| Durability: | 24 months |
| Storage: | store at 5 - 25 °C, cool and dry, originally sealed |
| Processing temperature: | at room temperature (usually 20 - 25 °C) |
EO-B-008B is a 31TP3 high performance No Clean flux based on alcohol with di-carboxylic acids and synthetic resin. This flux was developed for wave soldering processes as well as for dip soldering processes and strand tinning. It can be applied using all standard application methods (except foaming).
EO-B-008B is a flux classified as "non-corrosive".
Information on the ingredients (hazardous substances), safe handling, storage, transportation and disposal can be found in the current safety data sheet (SDS, SDS, MSDS).
Recommendation from practice:
This flux is very versatile, with good results in wave soldering and special applications. The generally applicable rule that the amount of flux applied should always be as low as possible also applies to this product.
Spray fluxes: If dosing is possible, first set the flux quantity to 20 - 40 ml/min, observe the even flux distribution on the PCB (test with thermal paper if necessary) and then correct to the optimum quantity.
Preheating: For "simple" printed circuit boards, a preheating temperature of
80 - 110 °C, for "more complex" PCBs from 100 - 130 °C on the top side of the PCB is recommended. It can be used in both leaded and lead-free solder systems.
