Wave, selective and manual soldering processes
No Clean-Flux, alcohol-based
Di-carboxylic acid resin complex, contains resin additive, halide-free (WEEE/RoHS compliant) [OSP compatible]
Type ISO 9454: 2231 (2.2.3.A) // DIN-EN 61190-1-1: (IEC ORL0)
| Appearance: | light yellow, clear liquid |
| Hazardous goods: | Yes |
| Solids content: | 2.1 wt.-% |
| Acid value: | 13 - 16 mg KOH/g |
| Halogenide-free: | Yes |
| Resinous: | Yes |
| Available as a concentrate: | Yes |
| Density at 20 °C: | 0.793 (+/- 0.003) g/ml |
| Flash point: | 12 °C |
| Durability: | 12 months |
| Storage conditions: | cool, dry and protected from light at 5 - 25 °C |
EO-B-024A is a No Clean flux of the latest generation. This multi-flux was developed for wave, selective and manual soldering processes and contains special activators that additionally strengthen the soldering process. It can be applied using all standard application methods (except foaming). The solids content is 2.1 wt.-% and is corrosion-free. Additional information on the ingredients (hazardous substances), safe handling, storage, transportation and disposal can be found in the current safety data sheet (SDS, SDS, MSDS). Recommendations for processing this flux: This flux is very versatile and OSP-compatible. Good results have been achieved in manual, wave and selective soldering as well as in cable assembly/strand tinning. The generally applicable rule that the amount of flux applied should always be as low as possible also applies to this product.
Spray fluxes: If dosing is possible, initially set the flux quantity to 20 - 30 ml/min, check the even distribution of the flux on the PCB (test with thermal paper if necessary) and then correct to the optimum quantity.
Preheating: A preheating temperature of 80 - 110 °C is recommended for "simple" PCBs and 100 - 130 °C for "more complex" PCBs. It can be used in both leaded and lead-free solder systems.
