Wave soldering, dip soldering and strand tinning
No Clean-Flux, alcohol-based
Di-carboxylic acid complex, halide-free (WEEE /RoHS compliant)
Type ISO-9454: 1231 (1.2.3.A) // DIN-EN 61190-1-1 (J-STD-004) (IEC REL0)
| Appearance: | Colorless to slightly reddish, clear liquid |
| Hazardous goods: | Yes |
| Solids content: | 2.6 wt.-% |
| Acid value: | 22 - 26 mg KOH/g |
| Halogenide-free: | Yes |
| Resinous: | Yes |
| Available as a concentrate: | No |
| Density at 20 °C: | 0.798 (+/- 0.005) g/ml |
| Flash point: | 12 °C |
| Durability: | 12 months |
GSP-2633/RX/OVAP is a flux of the latest generation. It is a high-performance no-clean flux based on alcohol with a di-carboxylic acid activator complex and synthetic resin. This flux was developed for selective and wave soldering processes as well as for dip soldering processes and strand tinning. It can be applied using all standard application methods (except foaming). This flux is very versatile. Good results are achieved both in wave soldering and in special applications. The generally applicable rule that applied flux quantities should always be as low as possible also applies to this product.
Spray fluxes: If dosing is possible, first set the flux quantity to 15 - 30 ml/min, observe the even flux distribution on the PCB (test with thermal paper if necessary) and then correct to the optimum quantity.
Preheating: A preheating temperature of 80 - 110 °C is recommended for "simple" PCBs and 100 - 130 °C for "more complex" PCBs. It can be used in both leaded and lead-free solder systems.
