Wave soldering (spray and foam fluxing)
No Clean-Flux, alcohol-based
Di-carboxylic acids, synthetic resin, halide-free (WEEE/RoHS-compliant)
Type ISO-9454: 1231 // DIN EN 61190-1-1 (according to J-STD-004) (IEC: REL0)
| Appearance: | colourless, light yellowish, transparent liquid |
| Hazardous goods: | Yes |
| Solids content: | 2.5 wt.-% |
| Acid value: | 21 - 25 mg KOH/g |
| Halogenide-free: | Yes |
| Resinous: | Yes |
| Available as a concentrate: | no |
| Density 20 °C | 0.794 (+/- 0.003) g/ml |
| Flash point: | 12 °C |
| Durability: | 12 months |
S-250/FR is the standard flux for wave soldering. Special additives ensure a fine-pored, stable foam head. It is successfully used on a wide variety of system and wave types in both leaded and lead-free processes. Its high temperature stability and very good activity over a wide temperature range ensure a wide process window with the best soldering results. The surfaces are very clean after soldering and the SIR is above the standard specifications. S-250/FR is suitable for foam and spray fluxing, it is not recommended for selective and hand soldering (see also product matrix). In practice, it has been shown that when used correctly, washing of PCBs soldered with this flux can be largely dispensed with. IC testing with needle adapters is generally not impaired.
