Wave soldering (spray fluxing), manual and selective soldering
No Clean water-based flux
Di-carboxylic acid complex, VOC-free, halogen-free (WEEE/RoHS compliant) [OSP-compatible]
Type ISO-9454: 2131 \ DIN EN 61190-1-1 8 (according to J-STD004) (IEC: ORL0)
| Appearance: | colorless, transparent liquid |
| Hazardous goods: | No |
| VOC: | 0,0 % |
| Solids content: | 5.0 wt.-% |
| Acid value: | 40 - 46 mg KOH/g |
| Halogen-free: | Yes |
| Resinous: | No |
| Activators/resin: | Di-carboxylic acid complex, VOC-free, halogen-free |
| Additives: | wetting agent, alcohol compound <10 % |
| Solvent: | Water-based |
| Flash point: | non-flammable |
| Available as a concentrate: | Yes |
| Durability: | 12 months |
EO-G-006 is a no-clean flux, universally suitable for wave, hand and selective soldering of printed circuit boards and contains organic, halogen-free, activating additives specially adapted to the soldering processes. This flux has been developed in a combination with lead-containing and lead-free solders specially adapted to the thermal requirements of the soldering process.
EO-G-006 is based on a novel formulation to stabilize and improve the application process compared to conventional water-based or partially water-based fluxes.
EO-G-006 is a water-based electronic flux and non-corrosive. The solids content is 5 %.
Recommendations for processing:
This flux is very versatile and OSP-compatible.
Foam fluxes: Not recommended
Spray fluxes: If dosing is possible, first set the flux quantity to 10 - 20 ml/min, observe the even flux distribution on the PCB (test with thermal paper if necessary) and then correct to the optimum quantity.
Preheating: A preheating temperature of 80 - 110 °C is recommended for "simple" PCBs and 110 - 130 °C for "more complex" PCBs on the top side of the PCB. It can be used in leaded or lead-free solder systems.
