Repair work on printed circuit boards, dip tinning
No Clean flux gel
Highly active, resin-free, halogenide-free activated, water-soluble (WEEE/RoHS-compliant)
Type ISO-9454: 2131 DIN EN 61190-1-1 (according to J-STD004): ORL0
Product, similar to the illustration shown.
This flux gel was developed for repair work on printed circuit boards. The activator base contains the same active ingredients as the comparable electronic flux EO-B-006 as well as variants EO-B-006A, EO-B-006B and EO-B-006C.
FLUX GEL EO-B-006 is highly concentrated and is characterized, among other things, by high activity as well as good wetting and spreading properties. Due to these properties, the paste should be applied sparingly. The gel is applied from a dosing syringe using metal dosing needles. These enable precise application and positioning of the flux. FLUX GEL EO-B-006 can be applied using a hot air or soldering iron.
In individual cases, which must be checked by the user, this flux gel can also be used to support the wave soldering of critical components. The application is carried out as described above.
- Ideal when using the flux series EO-B-006 (A-C/X), uniform activator base
- Ideal for applications according to IPC / IPC 610
- Flawless soldering results
- Economical in consumption
- Contaminated pads and component legs are also activated
- No crystallization, paste remains homogeneous and stable
- Careful and targeted dosing
- Metal dispensing needle is thermally resilient and can be used with a hot air or soldering iron during use
- Leaves no sticky residue
- Residues can be easily removed with DI water (H2O) (ideal at 40-60°C, also suitable for USB)
