Flux Gel EO-G-006

Recommended method of application

Repair work on printed circuit boards, dip tinning

No Clean flux gel
Halogenide-free activated, highly active (WEEE/RoHS-compliant)
Type ISO-9454: 2131 DIN EN 61190-1-1 (according to J-STD004): ORL0

Cat. no. 4738

Technical data

Working temperature:	at room temperature (usually 20 – 25 °C)
Storage conditions:	at 5 - 20 °C, dry, originally sealed
Durability:	12 months

Description

This flux gel was developed for repair work on printed circuit boards.
The activator base contains the same active ingredients as the comparable electronic flux EO-G-006 and variants EO-G-006 (A-C).

Flux Gel EO-G-006 is highly concentrated and is characterized, among other things, by high activity and good wetting and spreading properties. Due to these properties, the paste should be applied sparingly. The gel is applied from a dosing syringe using metal dosing needles. These enable precise application and positioning of the flux.

Flux Gel EO-G-006 can be applied using a hot air or soldering iron.

Customer added value

Ideal when using the flux series EO-G-006 (A-C), uniform activator base
Ideal for applications according to IPC / IPC 610
Flawless soldering results
Economical consumption
Contaminated pads and component legs are also activated
No crystallization, paste remains homogeneous and stable
Careful and targeted dosage
Metal dispensing needle is thermally resilient and can be used with a hot air or soldering iron during application.
Leaves no sticky residue

Packaging units

Syringe: 5 g

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Product information: Flux Gel EO-G-006