Wave soldering (spray fluxing), manual and selective soldering
No Clean water-based flux
Di-carboxylic acids, VOC-free, halogen-free (WEEE/RoHS-compliant) [OSP-compatible]
Type ISO-9454: 2131 \\ DIN EN 61190-1-1 (according to J-STD004) (IEC: ORL0)
| Appearance: | colorless, transparent liquid |
| Hazardous goods: | No |
| VOC: | 0,0 % |
| Solids content: | 7.0 wt.-% |
| Acid value: | 55 - 60 mg KOH/g |
| Halogen-free: | Yes |
| Resinous: | No |
| Activators/resin: | Di-carboxylic acids, VOC-free, halogen-free |
| Solvent: | Water-based |
| Additives: | wetting agent, alcohol compound <10 % |
| Flash point: | non-flammable |
| Available as a concentrate: | No |
| Durability: | 12 months |
The No Clean flux EO-G-007 is universally suitable for wave and selective soldering of printed circuit boards and contains organic, halogen-free, activating additives specially adapted to the soldering processes. This flux has been developed in a combination with lead-containing and lead-free solders that is specially adapted to the thermal requirements of the soldering process.
EO-G-007 is based on a novel formulation to stabilize and improve the application process compared to conventional water-based or partially water-based fluxes.
The flux is a water-based electronic flux and non-corrosive. The solids content is 7 wt.-%.
This flux is very versatile and OSP-compatible. Good results are achieved in manual, wave and selective soldering as well as in cable assembly and strand tinning. The general rule that the amount of flux applied should always be as low as possible also applies to this product.
Recommendations for processing:
Foam fluxes: Not recommended
Spray fluxes: If dosing is possible, first set the flux quantity to 10 - 20 ml/min, observe the even flux distribution on the PCB (test with thermal paper if necessary) and then correct to the optimum quantity.
Preheating: A preheating temperature of 80 - 110 °C is recommended for "simple" PCBs and 110 - 130 °C for "more complex" PCBs on the top side of the PCB. It can be used in both leaded and lead-free solder systems.
