Electronics
SMD adhesive

IQ-BOND 3202 (red)

Recommended method of application

Print

The high-quality SMD adhesives from IQ-Bond are suitable for double-sided PCBs, SMT mixed assembly and for small and large components

dekoratives Element

Technical data

Curing:1-2 min at 150 °C
5 min at 120 °C
Viscosity (mPa.s):600.000
Degree of hardness:85 D
Processing time:5 days

Description

The use of adhesives in electronics production has been an integral part of the industry for years. Adhesives are frequently used especially in the areas of bonding and fixing electronic components. Properties such as temperature stability, electrical conductivity, degassing, mechanical stability, durability and processability have continuously improved in the past.

Customer added value

  • Faster curing compared to conventional SMD adhesives, resulting in faster throughput processes
  • High-speed printing and dispensing as well as dosing applications
  • Comparable with lead-free soldering processes
  • Compliance with REACH/ROHS requirements
  • High initial strength and stable point profiles
  • Best process repeatability in the industry

Packaging units

Cartridge: 350 g
Injection syringes: 10 cm³, 30 cm³
Extras: And/or vessels
Product information: IQ-BOND 3202 (red)