Repair work on printed circuit boards, tinning of components
No Clean solder paste for electronics with metal alloy content
Halide-free and lead-free activators, low melting point (WEEE/RoHS-compliant)
Type ROL0 according to ANSI/J-STD-004 (IPC-TM-650)
This liquid solder paste (lead-free) with metal alloy content SnAg0.4Bi57.6 (>80 %) was developed for repair work on printed circuit boards and components. It has a low viscosity and is characterized by high activity as well as good wetting and spreading. Due to these properties, the paste should be applied sparingly. It is usually applied with a brush, but can also be applied individually. EO-FLP-005 can be applied using a hot air or soldering iron.
Important note: The paste must be stirred before use!
In individual cases, which must be checked by the user, this paste can also be used to support the wave soldering of critical components. The application is carried out as prescribed.
