Repair work on printed circuit boards, tinning of components
No clean rework paste for electronics with metal alloy content
Halogen-free and lead-free activators, low melting point (WEEE/RoHS-compliant)
Type ROL0 according to ANSI/J-STD-004 (IPC-TM-650)
This rework paste (lead-free) with metal alloy content [Sn 42.0 Ag 0.4 Bi 57.6] (>85 %) was developed for repair work on printed circuit boards and components and is characterized, among other things, by high activity as well as good wetting and spreading. Due to these properties, the paste should be applied sparingly. The paste is applied from a dosing syringe using a metal dosing needle. This enables precise dosing and positioning of the paste. The rework paste can be applied using a hot air or soldering iron.
In individual cases, which must be checked by the user, this paste can also be used to support the wave soldering of critical components. The application is carried out as prescribed.
- Highly effective for low melting processes
- Flawless soldering results
- Very wide process window
- Versatile application options
Economical consumption
- Contaminated pads and component legs are also activated
- No crystallization, paste remains homogeneous and stable
Careful and targeted dosing
- Low odor, hardly any steam development
