Automatic nozzle cleaning of selective soldering systems
Special cleaning fluid for cleaning the nozzles of selective soldering systems
Di-carboxylic acid-resin complex, halogen-free activation complex
| Appearance: | Colorless, light amber liquid |
| pH value: | 115 - 135 mg KOH/g |
| Density at 20 °C: | 0.84 - 0.86 g/cm³ |
| Activators: | Di-carboxylic acid-resin complex, halogen-free |
| Flash point: | 12 °C |
| Active ingredients: | short chain alcohols |
| Storage (recommendation): | cool, dry and protected from light at 15 - 25 °C |
| Durability: | 12 months |
EO-NCF-002 is organic-based, halogen-free activated and was specially developed for cleaning soldering nozzles. Due to its activation complex, this nozzle cleaner removes scaling and dross deposits on solder nozzles of selective soldering systems.
Processing instructions:
For light to moderate deposits on the nozzle: Switch off the selective shaft, wet the nozzle with EO-NCF-002, allow to take effect and switch the shaft back on after approx. 2-3 minutes (if necessary, also allow the shaft to run "lightly" for 2-3 minutes and then bring it up to operating power).
If there are heavy deposits on the nozzle: Switch off the selective shaft, wet the nozzle with EO-NCF-002, allow to take effect and switch the shaft back on after approx. 2-3 minutes. Then remove the deposits using a brush or similar and then switch the shaft back on. If the deposits have not yet been sufficiently removed, repeat the process.
