Flux pastes for efficient soldering of nickel and brass pins

THT components with nickel and brass pins are often used in durable electronic devices.

THT (Through-Hole Technology)-based electronic assemblies with nickel or brass pins can be used in various applications and environments. This applies in particular to areas with demanding environmental characteristics, where the electrical and mechanical properties of the pin materials play a decisive role. However, these pins are difficult to wet, which is why they pose a challenge in the soldering process.

"Components with nickel or brass pins are difficult to solder, where even long wetting times or high temperatures often do not lead to success. In addition, the circuit board and the components in the immediate vicinity can be damaged. This applies to both wave soldering and reworking."

Emil Otto has therefore developed a whole range of products to meet these challenges.

THT components with nickel and brass pins are frequently used in durable electronic devices, with the latter in particular offering high mechanical strength. Maximum reliability is required, especially in demanding environmental conditions.

"High resistance to corrosion and wear is particularly important in such application scenarios, as electronic components have to withstand extreme conditions. Nickel is the preferred material due to its protective properties. However, the processing poses some challenges."

As nickel oxide is a very good insulator, nickel is difficult to process. The insulating property acts like a barrier, which makes soldering very difficult. Conventional fluxes often reach their limits here, which is why special fluxes are required. These must not only enable processing, but also protect the nickel surface from oxidation during storage. Emil Otto has therefore developed fluxes that consist of a carboxylic acid complex.

"For a flux to meet the requirements, it must have good soldering properties. In addition, it must not impair the wave or selective soldering process. Rather, it must be possible to solder reliably with the specified parameters. There are therefore many different requirements for a product if it is only intended to support the soldering of a specific type of pin. At the same time, there are aids that are much less obvious in their application than their effect would suggest. For example, immersing the pins in solder based on a carboxylic acid complex not only removes the oxide layer. It also protects the pins from further contamination and surface changes. This allows immediate further processing or storage."

Repair work on electronic components

Emil Otto has also developed product solutions in the area of reworking, such as the replacement of components for repair. These reliably extend and expand the product life cycle. For example, the flux paste EO-FLUX-Paste (BIO-BASED) FP-BIO-001 /2 "EO B-Power". In outdoor applications, assemblies are often exposed to harsh, demanding environments over long periods of time. If the electronics in this area fail, they have to be replaced. This sometimes affects complete assemblies, individual components or just the connector of a cable. This is where Emil Otto's flux pastes can be used. For example, the EO-FLUX paste (BIO-BASED) FP-BIO-001 "EO B-Power" or the EO-FLUX paste (BIO-BASED) FP-BIO-002 "EO B-Power".

Cat. no. 5001
Recommended method of application
High-quality electronics production and repair work on PCBA

No Clean-Flux paste "BIO-BASED" with a new and high effective activator formulation
Rosin-free (WEEE/RoHS compliant)
Type ISO-9454: 1131 (1.1.3.C) // EN 61190-1-1 (J-STD-004: L0) // IEC: RO-BIO L0

Cat. no. 5002
Recommended method of application
High-quality electronics production and repair work on PCBA

No Clean-Flux paste "BIO-BASED" with a new and high effective activator formulation
Rosin-free (WEEE/RoHS compliant)
Type ISO-9454: 1131 (1.1.3.C) // EN 61190-1-1 (J-STD-004: L0) // IEC: RO-BIO L0

Flux pastes

Thesis No Clean Flux pastes have been specially developed for high-quality electronics production and the repair of printed circuit boards. Both pastes are "BIO-BASED" and formulated with a B-POWER activator complex. The highly effective and unique "B-Power" activator complex is made up of specially balanced, natural and highly pure substances. The main components consist of specific waxes and resins that contain neither colophony resins nor synthetic resins. FP-BIO-001 and 002 are characterized by a strongly soldering process-optimized activity and very good wetting and penetration properties, which is why the pastes can be dispensed extremely economically.