Conventional soft soldering of copper and brass materials
Weichlötflussmittel auf Basis anorganischer Halogene, zinkfrei
Typ ISO 9454: 2.2.2.C
| Appearance: | Colorless to light yellow paste |
| Density at 20 °C: | 0,9 g/cm³ |
| pH value: | nicht anwendbar |
| Water solubility: | schlecht wasserlöslich |
| Melting point: | 90 °C |
| Residues: | are to be removed |
| Durability: | 24 months |
