Description
EO-B-008A is a 21TP3 high performance No Clean-Flux based on alcohol with di-carboxylic acids and synthetic resin. This flux was developed for wave soldering and dip soldering processes. This variant was specially developed for full tunnel nitrogen applications and guarantees significantly better soldering results than conventional adipic acid solutions under full nitrogen thanks to a wide process window and high temperature stability.
It can be applied using all standard application methods (except foaming). EO-B-008A is classified as a "non-corrosive" flux.
Information on the ingredients (hazardous substances), safe handling, storage, transport and disposal can be found in the current safety data sheet (SDS, SDS, MSDS).
Recommendations for the processing of this flux:
This flux is very versatile, both in wave soldering and special applications are good results. The generally valid rule to choose applied flux quantities as low as possible, also applies to this product.
Recommended parameters for wave soldering.
Spray fluxing: When dosing, the amount of flux initially to 30 – 50 ml / min. Adjust the uniform flux distribution on the printed circuit board (if necessary test with thermal paper) and then correct to the optimum amount.
Preheating: For “simple” PCBs, a preheat temperature of 80 – 110 °C, recommended for “more complex” boards from 100 – 130 °C on the top side of the PCB. The use can be made both in leaded and lead-free solder systems.
Customer added value
- Very good soldering properties (capillarity, wetting)
- Broad process window (high thermal stability, good activity over a long interval)
- Good residue behaviour (very clean, high SIR)
- Recommended for N2-systems