EO-B-008B (multiflux)

Recommended method of application

Selective, wave and dip soldering

No Clean flux, alcohol-based
Di-carboxylic acid complex, synthetic resin, halogenide-free (WEEE/RoHS compliant)
Type ISO-9454: 1231 // DIN EN 61190-1-1: (acc. J-STD 004): [IPC: REL0]

Cat.-No. 6162

Technical data

Appearance:	colourless to reddish, clear liquid
Solids content:	2.9 - 3.2 wt.-%
Acid number:	23 - 27 mg KOH/g
Density at 20 °C:	0.795 (+/- 0.003) g/ml
Activators:	di-carboxylic acid complex with synthetic resin
Solvent:	mixture of monohydric alcohols
VOC:	97 %
Flash point:	12 °C
Durability:	24 months
Storage conditions:	at 5 – 25 °C, cool and dry, originally sealed, fire protection and Ex-protective regulations must be observed
Processing temperature:	at room temperature (usually 20 – 25 °C)

Description

EO-B-008B is a flux of the latest generation. It is a high performance No Clean flux based on alcohol with di-carboxylic acid and synthetic resin. This flux was used for selective and wave soldering processes as well as dip soldering.

The application can be carried out by any usual application method (except foams). The solids content is 3%. EO-B-008B is totally free from corrosion action.
Information on the ingredients (hazardous substances), safe handling, storage, transport and disposal can be found in the current safety data sheet (SDS, SDS, MSDS).

Customer added value

Very good soldering properties (capillarity, wetting)
Broad process window (high thermal stability, good activity over a long interval)
Good residue behaviour (very clean, high SIR)

Recommendations for the processing of this flux:
This flux is very versatile, both in wave soldering and special applications are good results. The generally valid rule to choose applied flux quantities as low as possible, also applies to this product. Recommended parameters for wave soldering.

Spray fluxing: When dosing, the amount of flux initially to 20 – 40 ml / min. Adjust the uniform flux distribution on the printed circuit board (if necessary test with thermal paper) and then correct to the optimum amount.

Preheating: For “simple” PCBs, a preheat temperature of 80 – 110 °C, recommended for “more complex” boards from 100 – 130 °C on the top side of the PCB. The use can be made both in leaded and lead-free solder systems.

Packaging units

Canister: 5 l, 20 l

Extras: Other packaging units on request

Download product information

Product information: EO-B-008B (multiflux)