EN
Electronics
Alcohol-based flux

EO-B-026 (Multiflux)

Recommended method of application

Wave, selective and manual soldering processes, strand tinning

No Clean-Flux, alcohol-based
Di-carboxylic acid resin complex, halide-free (WEEE/RoHS-compliant) [OPS-compatible]
Type ISO 9454: 1131 // DIN-EN 61190-1-1 (according to J-STD-004): L0 (IPC : ROL0)

Cat. no. 6156
6156-kanister-eo-b-026-en

Technical data

Appearance:Colorless to amber-colored, clear liquid
Solids content:4.5 - 5.3 wt.-%
Acid number:32 - 38 mg KOH/g
Halogenide-free:Yes
Resinous:Yes
Activators:Di-carboxylic acid-resin complex
Density at 20 °C:0.799 (+/- 0.004) g/ml
Flash point:12 °C
Solvent:short-chain alcohols
Flash point:95 %
Durability:12 months
Storage conditions:cool and dry at 5 - 25 °C
Working temperature:at room temperature (20 - 25 °C)

Description

EO-B-026 is a flux of the latest generation. It is a high-performance no-clean flux based on alcohol with dicarboxylic acid activator complex and rosin. This flux was developed for selective and wave soldering processes as well as for dip soldering processes and strand tinning. It can be used with all standard application methods (except foaming). EO-B-026 is completely corrosion-free.

Instructions for use:
This flux is very versatile and OPS-compatible. Good results are achieved with manual, wave and selective soldering. The general rule of using flux as low as possible also applies to this product.

Recommendation from practice:
Spray fluxing: If possible, first try out a quantity of 15 - 30 ml/min. and observe the distribution of the flux. Then correct the quantity. Air pressure: 18 - 20 l/min.

Preheat (when using a preheating system): The temperature on the top side of the PCBs should be 80 - 110 °C when entering the solder wave, depending on the type of PCB, layout, etc. When using lead-free solders, preheating temperatures of 100 - 130 °C on the top side are possible.

Customer added value

  • Wide range of applications
  • Outstanding soldering properties (penetration, wetting)
  • Almost residue-free despite higher solids content
  • Best soldering results even with outdated or overlapping PCBs and components
  • Wide process window (very high thermal stability, very good activity over a very large interval)
  • Successful passing of internal test (SIR selective)
  • Best results, especially with OSP and ENIG soldered surfaces

Packaging units

Canister: 5 l, 20 l
Extras: Other packaging units on request
Product information: EO-B-026 (Multiflux)