Description
EO-F-001 was developed for wave, selective, dip and manual soldering processes as well as cable assembly. The application can be carried out by all usual application methods (including foam fluxes). The solids content is 2.5 wt.-%.
In practice it has been shown that when used properly, the washing of the circuit boards soldered with this flux can largely be dispensed with. Needle adapters IC testing is usually unaffected and easily done.
Customer added value
- Wide range of applications (multiflux)
- Very good soldering properties (capillarity, wetting)
- Broad process window (high thermal stability, good activity over a long interval)
- Very good residue behavior (optically very clean, high SIR)