EO-F-001A (Multiflux)

Recommended method of application

Wave, selective, dip and hand soldering processes as well as cable assembly

No Clean-Flux, alcohol- and water-based
Di-carboxylic acid-resin complex, halide-free (WEEE/RoHS compliant)
Type ISO 9454: 2231 / DIN-EN 61190-1-1 (according to J-STD-004) (IPC ORL0)

Cat.-No. 6464

Technical data

Appearance:	colourless to yellowish, transparent liquid
VOC:	93 %
Solids content:	1.9 - 2.2 wt.-%
Acid number:	15 - 18 mg KOH/g
Density 20°:	0.80 - 0.82 g/ml
Activators/resin:	di-carboxylic acid-resin complex, halide-free
Solvent:	mixture of monohydric alcohols and ester compounds
Flash point:	12 °C
Storage conditions:	cool and dry at 5 - 25 °C, originally sealed
Processing temperature:	at room temperature (usually 20 – 25 °C)
Durability:	12 months

Description

EO-F-001A is a No Clean-Flux for wave, selective, dip and hand soldering processes as well as strand tinning. It is suitable for all common application processes, including foam fluxing. With its wide process window and high temperature stability, it is convincing in practice, PCBs generally do not need to be washed and IC tests with needle adapters remain unaffected. It can be used in both leaded and lead-free solder systems.

The solids content is 2 %. EO-F-001A is classified as a "non-corrosive" flux.

Recommendations for the processing of this flux:

Spray fluxing: If dosing is possible, first set the flux quantity to 35 - 50 ml/min, observe the even flux distribution on the PCB (test with thermal paper if necessary) and then correct to the optimum quantity.

Foam fluxing: Uniform compressor performance is required for a stable, fine-pored foam head. When using compressed air from the mains, water and oil separators and at least one pressure reducer must be connected upstream. The optimum inlet pressure is 0.6-0.8 bar. Foam blocks or foam tubes with a pore size of 10-20 µm facilitate fluxing. The nozzle slot should be a maximum of 15 mm; lateral support plates increase foam stability. After foam fluxing, blowing off with air is recommended to distribute the flux evenly and avoid excess.

Preheating: A preheating temperature of 80 - 110 °C is recommended for "simple" PCBs and 100 - 130 °C on the top side of "more complex" PCBs.

The generally applicable rule that the amount of flux applied should always be as low as possible also applies to this product.

Packaging units

Canister: 5 l, 20 l

Extras: Other packaging units on request

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Product information: EO-F-001A (Multiflux)