EN
Electronics
Alcohol- and water-based flux

EO-F-002C (Multiflux)

Recommended method of application

Wave and selective soldering as well as soldering and tinning processes for high-quality electronics production

No Clean-Flux, alcohol- and water-based
Di-carboxylic acid resin complex, halide-free (WEEE/RoHS compliant)
Type ISO 9454: 2231 // DIN-EN 61190-1-1 (according to J-STD-004):L0 (IPC ORL0)

Cat. no. 6469
EN_6469-Kanister-EO-F-002C

Technical data

Appearance:colourless to yellowish, transparent liquid
VOC:75 %
Solids content:3.9 - 4.2 wt.-%
Acid number:30 - 36 mg KOH/g
Density at 20 °C:0.84 - 0.86 g/ml
Activators/resin:di-carboxylic acid-resin complex, halide-free
Solvent:mixture of monohydric alcohols, ester compounds, H2O
Flash point:19 °C
Storage conditions:cool and dry at 5 - 25 °C, originally sealed
Processing temperature:at room temperature (usually 20 - 25°C)
Durability:12 months

Description

EO-F-002C is a No Clean-Flux and was specially developed for wave, selective, dip and hand soldering processes as well as strand tinning. It can be applied using all standard application methods including foam fluxing.
In practice, it has been shown that when used properly, washing of PCBs soldered with this flux can be largely dispensed with. IC testing with needle adapters is generally not impaired

The solids content is 4 %. EO-F-002C is classified as a "non-corrosive" flux.

Recommendations for the processing of this flux:

This flux is very versatile and can be used for wave soldering and special applications. The generally applicable rule that the amount of flux applied should always be as low as possible also applies to this product.

Spray fluxing: When dosing, the amount of flux initially to 20 – 40 ml / min. Adjust the uniform flux distribution on the printed circuit board (if necessary test with thermal paper) and then correct to the optimum amount.

Preheating: For “simple” PCBs, a preheat temperature of 80 – 110 °C, recommended for “more complex” boards from 100 – 130 °C on the top side of the PCB. The use can be made both in leaded and lead-free solder systems.

Foam fluxing: The compressor output should be even, so that a stable and fine-pored foam crown is achieved. When compressed air supply from the network, the interposition of a water and oil separators and at least one pressure reducer is required. Optimal is an air pressure in the range of 0.6 – 0.8 bar. Fine-pored foam stones or pipes (10 – 20 μm) facilitate foam flow. The nozzle slot should not be more than 15 mm. Side-mounted, perforated support plates promote the stability of the foam. After the foam has been flown, it is recommended to blow off with air to evenly distribute the flux and retain excess amounts.

Packaging units

Canister: 5 l, 20 l
Extras: Other packaging units on request
Product information: EO-F-002C (Multiflux)