EO-F-002C/OVAP

Recommended method of application

Wave and selective soldering as well as strand tinning, soldering and tinning processes for the manufacture of high-quality electronic products

No Clean-Flux, alcohol- and water-based
Di-carboxylic acid resin complex, halide-free (WEEE/RoHS compliant)
Type ISO 9454: 2231 // DIN-EN 61190-1-1 (according to J-STD-004):L0 (IPC ORL0)

Cat.-No. 6471

Technical data

Appearance:	colourless to yellowish, transparent liquid
VOC:	75 %
Solids content:	3.9 - 4.2 wt.-%
Acid number:	30 - 36 mg KOH/g
Density 20°	0.84 - 0.86 g/ml
Activators/resin:	di-carboxylic acid-resin complex, halide-free
Solvent:	mixture of monohydric alcohols, ester compounds, H2O
Flash point:	19 °C
Storage conditions:	cool and dry at 5 - 25 °C, originally sealed
Processing temperature:	at room temperature (usually 20 - 25°C)
Durability:	12 months

Description

EO-F-002C/OVAP is a No Clean-Flux and has been specially developed for wave, selective, dip and hand soldering processes as well as for strand tinning. It can be applied using all common application methods except foam fluxing.
Practical experience has shown that, when used correctly, washing PCBs soldered with this flux is largely unnecessary. IC testing with needle adapters is generally not affected.

The solids content is 4 %. EO-F-002C/OVAP is classified as a "non-corrosive" flux.

Recommendations for the processing of this flux:
This flux is very versatile and can be used for wave soldering as well as for special applications. The generally applicable rule that the amount of flux applied should always be as low as possible also applies to this product.

Spray fluxing: When dosing, first set the flux quantity to 35 - 50 ml/min. Ensure even flux distribution on the circuit board (test with thermal paper if necessary) and then correct to the optimum quantity.

Preheating: For "simple" PCBs, a preheating temperature of 80 - 110 °C is recommended, for "more complex" PCBs 100 - 130 °C on the top side of the PCB. It can be used in both leaded and lead-free solder systems.

Packaging units

Canister: 5 l, 20 l

Extras: Other packaging units on request

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Product information: EO-F-002C/OVAP