Description
The soldering flux paste EO-FP-001 has been developed for repair soldering. In addition, the soldering flux paste is suitable for dip tinning as well as special applications. EO-FP-001 is characterized by a high activity and good wetting and spreading properties. Due to these properties, the paste should be applied sparingly. Application takes place via a dosing syringe with a plastic tip. This enables the accurate dosing and positioning of the paste. The processing of the soldering flux paste can be done with the aid of hot air or soldering irons.
Customer added value
- Excellent soldering properties (capillarity, wetting)
- Broad process window (very high thermal stability, very good activity over long interval 150 °C – 260 °C)
- Low corrosion tendency despite very strong activation
- Contains no free acid und no resin
- No curing or crystallization effect
- Exact, drip-free dosage
- Minimal smoke and odour generation
- Flux residues visible under UV light
- VOC-free