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Electronics
Flux paste

EO-FP-003

Recommended method of application

Repair work on printed circuit boards, dip tinning

No Clean-Flux paste
Halogen-free activators (WEEE/RoHS-konform)
Type ISO-9454: 1131 (1.1.3.C) // DIN EN 61190-1-1 (acc. to J-STD-004:L0) (IEC: ROL0)

Cat. no. 4683
FP-003_520x520px

Technical data

Appearance:amber coloured, waxy, mild paste
Activators/resin:halogen-free
Viscosity:highly viscous
Storage conditions:im closed original container at 5 - 20 °C, dry
Processing temperature:at room temperature (usually 20 – 25 °C)
Durability:12 months

Description

The No Clean-Flux paste EO-FP-003 was specially developed to repair assemblies. Among other things, it is characterised by strong activity and very good wetting and spreading behaviour. Due to these properties, the paste can be dispensed very sparingly. The paste is applied via a stainless steel dosing needle (optionally also a plastic dosing needle).

The flux paste can be processed, for example, using hot air and soldering irons, but also with a mini-wave.

Customer added value

  • Recommended for applications according to IPC / IPC 610
  • Perfect soldering results
  • Economical in consumption
  • Also contaminated (old) pads and component pins are activated
  • Careful and targeted dosage
  • VOC-free

Packaging units

Syringe: 5 ml, 10 ml
Product information: EO-FP-003