Water-based fluxes

EO-G-006 (multiflux)

Recommended method of application

Wave soldering (spray fluxing), hand and selective soldering

No Clean-Flux, water-based
Di-carboxylic acid complex, VOC-free, halogen-free (WEEE/RoHS compliant) [OSP compatible]
Type ISO-9454: 2131 DIN EN 61190-1-1 8 (according to J-STD004) (IEC: ORL0)

Cat.-No. 6131
Kanisterabbildung 5 Liter No Clean-Flussmittel EO-G-006C

Technical data

Appearance:colourless, transparent liquid
Hazardous goods:No
VOC:0,0 %
Solids content:5.0 wt.-%
Acid number:40 - 46 mg KOH/g
Halogen-free:Yes
Resiny:No
Activators/resin:di-carboxylic acid complex, VOC-free, halogen-free
Additives:wetting agent, alcohol compound <10 %
Solvent:Water-based
Flash point:non flammable
Available as a concentrate:Yes
Durability:12 months

Description

EO-G-006 is universally suitable for wave, hand and selective soldering of PCBs and complies with specification DIN-EN 61190-1-1: L0. Accordingly, it contains organic, halogen-free activating additives in a combination specially tuned to the thermal requirements of the soldering processes.

EO-G-006 is based on a novel formulation to stabilise and improve the application process compared to conventional water or partial water based fluxes. It can be applied by brushing, spraying, dipping etc. (except for foam application). EO-G-006 is a water-based flux and totally free from corrosion action. The solids content is 5 % by weight.
EO-G-006 is a water-based electronic flux and non-corrosive. The solids content is 5 %.

Customer added value

  • Non-flammable (no legal restrictions on transport, storage and handling)
  • Very good soldering properties (capillarity, wetting)
  • Available as concentrate (granulate)
  • Broad process window (high thermal stability, good activity over a long interval)
  • Very good residue behaviour (optically very clean, high SIR)

Recommendations for processing:
This flux is very versatile and OSP compatible.

Foam fluxes: Not recommended

Spray fluxing: If dosing is possible, first adjust the flux quantity to 10 – 20 ml/min, observe the even flux distribution on the PCB (test with thermal paper if necessary) and then correct to the optimum quantity.

Preheating: For “simple” PCBs a preheating temperature of 80 – 110 °C is recommended, for “more complex” PCBs 110 – 130 °C on the top side of the PCB. It can be used in both leaded and lead-free solder systems.

Packaging units

Canister: 20 l
Concentrate: for 20 l

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Product information: EO-G-006 (multiflux)