Description
EO-G-006A is a No Clean flux universally suitable for wave, hand and selective soldering of printed circuit boards and contains organic, halogen-free, activating additives specially adapted to the soldering processes. This flux has been developed in a combination with leaded and lead-free solders that is specially adapted to the thermal requirements of the soldering process. EO-G-006A is based on a new formulation to stabilize and improve the application process compared to conventional water or partially water-based fluxes. EO-G-006A is a water-based electronic flux and non-corrosive. The solids content is 2 % by weight.
Recommendations for processing:
This flux is very versatile and OSP compatible.
Foam fluxes: Not recommended
Spray fluxing: If dosing is possible, first set the flux quantity to 15 - 20 ml/min, observe the even flux distribution on the PCB (test with thermal paper if necessary) and then correct to the optimum quantity.
Preheating: For 'simple' PCBs, a preheating temperature of 80 - 110 °C is recommended, for 'more complex' PCBs 110 - 130 °C on the top side of the PCB. It can be used in both leaded or lead-free solder systems.
Customer added value
- Non-flammable (no legal restrictions for transport, storage and handling)
- Very good soldering properties (capillarity, wetting)
- Very good soldering properties (capillarity, wetting)
- Available as concentrate (granulate)
- Broad process window (high thermal stability, good activity over a long interval)
- Very good residue behavior (optically very clean, high SIR)
- Recommended for N2-systems