Electronics
Comparison list
Water-based fluxes

EO-G-007 (multiflux)

Recommended method of application

Wave soldering (spray fluxing), hand and selective soldering

No Clean-Flux, water-based
Di-carboxylic acids, VOC-free, halogen-free (WEEE/RoHS compliant)
Typ ISO-9454: 2131 DIN EN 61190-1-1 (gem. J-STD004) (IEC: ORL0)

Cat.-No. 6132
6132_EO-G-007_Kanister_EN_520x520px

Technical data

Appearance:colourless, transparent liquid
Hazardous goods:No
VOC:0,0 %
Solids content:7.0 wt.-%
Acid number:55 - 60 mg KOH/g
Halogen-free:Yes
Resiny:No
Activators/resin:di-carboxylic acids, VOC-free, halogen-free
Solvent:Water-based
Additives:wetting agent, alcohol compound <10 %
Flash point:non flammable
Available as a concentrate:No
Durability:12 months

Description

The No Clean-Flux EO-G-007 is universally suitable for wave and selective soldering of printed circuit boards and contains organic, halogen-free, activating additives specially adapted to the soldering processes. This flux has been developed in a combination with leaded and lead-free solders specially adapted to the thermal requirements of the soldering process.
EO-G-007 is based on a novel formulation to stabilize and improve the application process compared to conventional water or partial water based fluxes.
The flux is a water-based electronic flux and is non-corrosive. The solids content is 7% by weight.

Customer added value

  • Non-flammable (no legal restrictions on transport, storage and handling)
  • Very good soldering properties (capillarity, wetting)
  • Available as concentrate (granulate)
  • Broad process window (high thermal stability, good activity over a long interval)
  • Very good residue behavior (optically very clean, high SIR)

Recommendations for processing:

This flux is very versatile and OSP compatible. Good results are achieved in hand, wave and selective soldering as well as in cable assembly and stranded wire tinning. The generally applicable rule of choosing flux quantities that are as low as possible also applies to this product.

Foam fluxes: Not recommended

Spray fluxing: If dosing is possible, first adjust the flux quantity to 10 – 20 ml/min, observe the even flux distribution on the PCB (test with thermal paper if necessary) and then correct to the optimum quantity.

Preheating: For “simple” PCBs a preheating temperature of 80 – 110 °C is recommended, for “more complex” PCBs 110 – 130 °C on the top side of the PCB. It can be used in both leaded and lead-free solder systems.

Packaging units

Canister: 5 l, 20 l
Download product information
Product information: EO-G-007 (multiflux)