Description
EO-Y-005B is universally suitable for wave and selective soldering of printed circuit boards and contains organic, halogen-free, activating additives formulated with a small addition of synthetic resin. This flux was developed in a combination with lead-containing and lead-free solders specially adapted to the thermal requirements of the soldering process.
EO-Y-005B contains special alcoholic additives to stabilize and improve drying times compared to conventional water-based or partially water-based fluxes.
Recommendations for processing this flux:
This flux is very versatile and OSP-compatible. Good results have been achieved in manual, wave and selective soldering as well as in cable assembly/strand tinning. The general rule that the amount of flux applied should always be as low as possible also applies to this product.
Foam fluxes: Not recommended
Spray fluxing: With the dosing option quantify the flux, first set to 30 – 40 ml/min., observe the even distribution of flux on the circuit board (if necessary test with heatsensitive paper) and then adjust to the optimal quantity.
Preheating: With “simple” circuit boards a preheating temperature of 80 – 110 °C is recommended on the top side of the circuit board, with “more complex” boards from 100 – 130 °C. The flux can be used both in systems containing leades as well as those that are lead-free.
Customer added value
- Wide range of applications (multiflux)
- Very good soldering properties (capillarity, wetting)
- Broad process window (high thermal stability, good activity over a long interval)
- Very good residue behavior (optically very clean, high SIR)