Description
EO-Y-006A is universally suitable for the wave- and selective soldering of circuit boards and contains organic, halogen-free, activating additives formulated with a small amount of synthetic resin. This flux was developed in a combination with leaded and lead-free solders, coordinated especially to the thermal requirements of the soldering process. EO-Y-006A contains special alcoholic additives for the stabilization and improvement of the drying time in comparison with conventional water- or partially water-based fluxes.
Recommendations for the processing of this flux:
This flux is very versatile in use and OSP-compatible. Good results are achieved with manual, wave and selective soldering as well as for dip soldering. The generally applicable rule, to basically select as little of the applied flux as possible, is also valid for this product.
Foam fluxes: Not recommended
Spray fluxing: If possible, try at first a quantity of 20 – 30 ml/min. and observe the distribution of the flux. After that, correct to the quantity. Air-pressure: 18 – 22 l/min.
Preheating: With “simple” circuit boards a pre-heating temperature of 80 – 110 °C is recommended on the top side of the circuit board, with “more complex” boards a temperature of 100 – 130 °C is recommended. The operation can be carried out both in solder systems containing leaded as well as lead-free solder systems.
Customer added value
- Wide range of applications (multiflux)
- Very good soldering properties (capillarity, wetting)
- Broad process window (high thermal stability, good activity over a long interval)
- Very good residue behavior (optically very clean, high SIR)