Description
EO-Y-006B is universally suitable for wave and selective soldering of printed circuit boards and contains organic, halogen-free, activating additives formulated with a small addition of synthetic resin. This flux was developed in a combination with lead-containing and lead-free solders specially adapted to the thermal requirements of the soldering process.
EO-Y-006B contains special alcoholic additives to stabilize and improve drying times compared to conventional water-based or partially water-based fluxes.
Recommendations for processing this flux:
This flux is very versatile and OSP-compatible. Good results are achieved in manual, wave and selective soldering, dip soldering and strand tinning. The general rule that the amount of flux applied should always be as low as possible also applies to this product.
Foam fluxes: Not recommended
Spray fluxing: With the dosing option quantify the flux, first set to 30 – 40 ml/min., observe the even distribution of flux on the circuit board (if necessary test with heatsensitive paper) and then adjust to the optimal quantity.
Preheating: With “simple” circuit boards a preheating temperature of 80 – 110 °C is recommended on the top side of the circuit board, with “more complex” boards from 100 – 130 °C. The flux can be used both in systems containing leades as well as those that are lead-free.
Customer added value
- Wide range of applications (multiflux)
- Very good soldering properties (capillarity, wetting)
- Broad process window (high thermal stability, good activity over a long interval)
- Very good residue behavior (optically very clean, high SIR)