Description
EO-Y-006C is universally suitable for the wave and selective soldering of circuit boards and contains organic, halogen-free, activating additives formulated with a small amount of synthetic resin. This flux was developed in a combination with leaded and lead-free solders, coordinated especially to the thermal requirements of the soldering process. EO-Y-006C contains special alcoholic additives for the stabilization and improvement of the drying time in comparison with conventional water- or partially water-based fluxes.
Instructions for use::
This flux is very versatile in use and OSP-compatible. Good results are achieved with manual, wave and selective soldering, dip soldering as well as for strand tinning. The generally applicable rule, to basically select as little of the applied flux as possible, is also valid for this product.
Foam fluxes: Not recommended
Spray fluxing: If possible, try at first a quantity of 20 – 30 ml/min. and observe the distribution of the flux. After that, correct to the quantity. Air-pressure: 18 – 22 l/min.
Preheating: For “simple” PCBs, a preheating temperature of 80 – 110 °C is recommended, for “more complex” PCBs of 100 – 130 °C on the top side of the PCB. The use can be made both in leaded and lead-free solder systems.
Customer added value
- Wide range of applications (multiflux)
- Very good soldering properties (capillarity, wetting)
- Broad process window (high thermal stability, good activity over a long interval)
- Very good residue behavior (optically very clean, high SIR)