Description
The solvent-based, pH-neutral medium is suitable especially for cleaning nozzles and dispenser needles from solder paste as well as SMT adhesive residues. It is used in suitable cleaning systems (e.g. ultrasonic) at room temperature, increasing the cleaning performance temperature (40 - 55 °C) accelerates the process and improves the cleaning. The cleaned component is then rinsed with DI water.
Note:
Check the suitability of the cleaning system before use!
Customer added value
- Efficient removal of solder paste residues and SMT-adhesives within nozzles and dispensing needles
- Low odor
- High flash point
- Excellent water-rinsability
- Helps to eliminate flammable solvents from within the production area