Description
The water-based, pH-neutral cleaning medium efficiently removes residues of leaded, lead-free or so-called no-clean solder pastes as well as SMT adhesives from the underside of the stencil. After the printing process, Etimol SUC 61 RAN optimally wets both the cleaning roller or cleaning fleece and the stencil side, so that consistently high and qualitatively reproducible cleaning results are achieved. The innovative homogeneous formulation and optimum drying behaviour minimize the phenomena of streaking and smearing of solder paste components often observed with commercially available water-based cleaners.
Instructions for use:
Depending on the printer model and manufacturer, the cleaning medium is either poured undiluted directly into the supply tank of the stencil printer at room temperature or drawn directly from the delivery container.
Note:
Consider approvals of equipment manufacturer!
Customer added value
- Reliably removes solder paste and SMT adhesive residues from the underside of the stencil to ensure optimum printing results
- Thanks to the water-based formulation, a high flash point and a high level of occupational safety are achieved, which helps to eliminate flammable solvents from the production area.