Description
The water-based, slightly alkaline cleaning medium efficiently removes residues of leaded, lead-free or so-called no-clean solder pastes as well as SMT adhesives from SMT stencils in automatic washing systems. The formulation has excellent compatibility with standard stencil materials and is particularly effective at cleaning μ-BGA and fine-pitch stencils. The innovative formulation achieves high bath loading values compared to standard cleaners, so that the intervals between bath changes can be significantly extended and the amount of waste for disposal can be significantly reduced in some cases.
Instructions for use:
The cleaner is excellently rinsable with water. The cleaning medium is filled into the cleaning tank of the stencil washer at room temperature.
Notes:
Consider approvals of equipment manufacturer!
Check the compatibility of the stencil adhesive used!
Customer added value
- Reliably removes solder paste and SMT adhesives from SMT stencils, especially recommended for μ-BGA and fine pitch
- The water-based composition ensures a high flash point and a high level of occupational safety and helps to remove flammable solvents from production.