Description
This flux gel was developed for repair work on printed circuit boards. The activator base contains the same active ingredients as comparable electronic fluxes
FLUX GEL EO-B-001 is highly concentrated and is characterized due to high activity and good wetting and spreading. Due to these properties, the paste should be applied sparingly. The gel is applied from a dosing syringe via metal dosing needles. These allow a precise application or positioning of the flux. The processing of FLUX GEL EO-B-001 can be done by hot air or soldering iron.
Customer added value
- Ideal when using flux EO-B-001 (A-C), uniform activator base
- Perfect soldering results
- Economical in consumption
- Also contaminated (old) pads and component pins are activated
- Paste is stable and shows no signs of polymerization (no sticking)
- Careful and targeted dosage
- Metal dosing needle is thermally resilient and can be used during use be used with
- Leaves no sticky residue