Description
This flux gel was developed for repair work on printed circuit boards. The activator base contains the same active ingredients as the comparable electronic flux EO-B-006 as well as variants EO-B-006A (Multiflux), EO-B-006B (Multiflux) and EO-B-006C (Multiflux).
FLUX GEL EO-B-006 is highly concentrated and is characterized due to high activity and good wetting and spreading. Due to these properties, the paste should be applied sparingly. The gel is applied from a dosing syringe via metal dosing needles. These allow a precise application or positioning of the flux. The processing of FLUX GEL EO-B-006 can be done by hot air or soldering iron.
Customer added value
- Ideal when using the flux series EO-B-006 (A-C/X), uniform activator base
- Recommended for applications according to IPC / IPC 610
- Perfect soldering results
- Economical to use
- Also contaminated (old) pads and component pins are activated
- No crystal formation, paste remains homogeneous and stable
- Careful and targeted dosing
- Metal dosing needle is thermally resilient and can be used during use be used with the hot air or soldering iron
- Leaves no sticky residue
- Residues can be easily removed with DI water (H2O)