Description
This flux gel was developed for repair work on printed circuit boards. The activator base contains the same active ingredients as the comparable electronic flux
FLUX GEL EO-B-007 is highly concentrated and is characterized due to high activity and good wetting and spreading. Due to these properties, the paste should be applied sparingly. The gel is applied from a dosing syringe via metal dosing needles. These allow a precise application or positioning of the flux. The processing of FLUX GEL EO-B-007 can be done by hot air or soldering iron.
Customer added value
- Ideal when using flux EO-B-007 (A-C), uniform activator base
- Perfect soldering results
- Economical to use
- Also contaminated (old) pads and component pins are activated
- No crystal formation, paste remains homogeneous and stable
- Careful and targeted dosing
- Metal dispensing needle can withstand thermal stress and can be used while used with hot air or soldering iron
- Leaves no sticky residue