EN
Electronics
Flux gel

Flux gel EO-G-006

Recommended method of application

Repair work on printed circuit boards, dip tinning

No Clean-Flux gel
Highly active, halide-free activated (WEEE/RoHS compliant)
Type ISO-9454: 2131 DIN EN 61190-1-1 (acc. J-STD004): ORL0

Cat. no. 4738
flux-gel-eo-g-006

Technical data

Processing temperature:at room temperature (usually 20 – 25 °C)
Storage conditions:at 5 - 20 °C, dry, originally sealed
Durability:12 months

Description

This flux gel was developed for repair work on printed circuit boards. The activator base contains the same active ingredients as the comparable electronic flux EO-G-006 and variants EO-G-006 (A-C).

The flux gel EO-G-006 is highly concentrated and is characterized by high activity as well as good wetting and spreading properties. Due to these properties, the paste should be applied sparingly. The gel is applied from a dosing syringe using metal dosing needles. These enable precise application and positioning of the flux.

Flux Gel EO-G-006 can be applied using a hot air or soldering iron.

Customer added value

  • Ideal when using the flux series EO-G-006 (A-C), uniform activator base
  • Recommended for applications according to IPC / IPC 610
  • Perfect soldering results
  • Economical in consumption
  • Also contaminated (old) pads and component pins are activated
  • Paste is stable and shows no signs of polymerization (no sticking)
  • Careful and targeted dosage
  • Metal dispensing needle can withstand thermal stress and can be used during used with hot air or soldering iron
  • Leaves no sticky residue

Packaging units

Syringe: 5 g
Product information: Flux gel EO-G-006