GSP-2633/RX/OVAP

Description

GSP-2633/RX/OVAP is a flux of the latest generation. It is a high-performance no-clean flux based on alcohol with a di-carboxylic acid activator complex and synthetic resin. This flux was developed for selective and wave soldering processes as well as for dip soldering processes and strand tinning. It can be applied using all standard application methods (except foaming). This flux is very versatile. Good results are achieved both in wave soldering and in special applications. The generally applicable rule that applied flux quantities should always be as low as possible also applies to this product.
Spray fluxing: When dosing, the amount of flux initially to 15 – 30 ml/min. adjust the uniform flux distribution on the printed circuit board (if necessary test with thermal paper) and then correct to the optimum amount.
Preheating: For “simple” PCBs, a preheat temperature of 80 – 110 °C, recommended for “more complex” boards from 100 – 130 °C on the top side of the PCB. The use can be made both in leaded and lead-free solder systems.

Customer added value

• Wide range of applications
• Very good soldering properties (capillarity, wetting)
• Broad process window (very high thermal stability, good activity over a long interval)
• Very good residue behaviour (very clean, high SIR)
• Successful passing of internal test (SIR selective)