GSP-2933/RX (multiflux)

Recommended method of application

Wave, selective and dip soldering, wire tinning

No Clean-Flux, alcohol-based
Di-carboxylic acid complex, halogen-free (WEEE/RoHS compliant)
Type ISO 9454: 1231 (1.2.3.A) // DIN-EN 61190-1-1 (J-STD-004): (IEC REL0)

Cat.-No. 3062

Technical data

Appearance:	colourless to reddish, clear liquid
Hazardous goods:	Yes
Solids content:	2.9 wt.-%
Acid number:	25 - 29 mg KOH/g
Halogenide-free:	Yes
Resiny:	Yes
Available as a concentrate:	No
Density at 20 °C:	0.79 (+/- 0.005) g/ml
Flash point:	12 °C
Durability:	12 months

Description

GSP-2933/RX is a flux of the latest generation. It is a high performance No Clean-Flux based on alcohol with di-carboxylic acid activator complex and synthetic resin. This flux was used for selective and wave soldering process, as well as for dip soldering process and cable strands tining. The application can be carried out by any usual application method (including foams). This flux is very versatile, both in wave soldering and special applications are good results. The generally valid rule to choose applied flux quantities as low as possible, also applies to this product.

Customer added value

Wide range of applications (multiflux)
Very good soldering properties (capillarity, wetting)
Broad process window (very high thermal stability, good activity over a long interval)
Very good residue behavior (very clean, high SIR)
Successful passing of internal test (SIR selective)

Spray fluxing: When dosing, the amount of flux initially to 15 – 30 ml/min. adjust the uniform flux distribution on the printed circuit board (if necessary test with thermal paper) and then correct to the optimum amount.
Foam fluxes: The compressor output should be even, so that a stable and fine-pored foam crown is achieved. When compressed air supply from the network, the interposition of a water and oil separators and at least one pressure reducer is required. Optimal is an air pressure in the range of 0.6 – 0.8 bar. Fine-pored foam stones or pipes (10 – 20 μm) facilitate foam flow. The nozzle slot should not be more than 15 mm. Side-mounted, perforated support plates promote the stability of the foam. After the foam has been flown, it is recommended to blow off with air to evenly distribute the flux and retain excess amounts.

Density correction: The Flux Thinner “K-113”, Cat.-No. 1003, is available for this purpose.
Preheating: For “simple” PCBs, a preheating temperature of 80 – 110 °C is recommended, for “more complex” PCBs of 100 – 130 °C on the top side of the PCB. The use can be made both in leaded and lead-free solder systems.

Packaging units

Canister: 5 l, 10 l, 20 l

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Product information: GSP-2933/RX (multiflux)