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Electronics
SMD adhesives

IQ-BOND 3202 (red)

Recommended method of application

Printing

The high-quality SMD adhesives from IQ-Bond are suitable for double-sided equipped printed circuit boards, SMT applications as well as mixed large and small components

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Technical data

Curing:1-2 min at 150 °C
5 min at 120 °C
Viscosity (mPa.s):600.000
Degree of hardness:85 D
Processing time:5 days

Description

The use of adhesives has for years been an integral part of electronics production. Adhesives are commonly used especially in the areas of the bonding and fixing of electronic components. In the past the properties such as temperature stability, electrical conductivity, degassing, mechanical stability, durability and processability have continuously improved.

Customer added value

  • Quick curing in comparison to conventional SMD adhesives which leads to quicker throughput processes
  • High-speed printing and dispensing as well as dosing applications
  • Comparable with lead-free soldering processes
  • Compliance with REACH/ROHS requirements
  • High initial strength and stable point profiles
  • Best process repeatability in the industry

Packaging units

Cartridge: 350 g
Injection syringes: 10 cm³, 30 cm³
Extras: And/or vessels
Product information: IQ-BOND 3202 (red)