EN
Electronics
EDSON

PreWipe IPA/DI wipes

Recommended method of application

Cleaning of soft solder paste, inks, solder and other residues

Premium cleaning for the electronics and printing industry
The cloths are of high quality, low-linting and the cleaner evaporates without leaving any residue.

dekoratives Element

Description

The wipes are made from a low-linting material and offer excellent strength and cleaning power. PreWipes are suitable for cleaning soft solder pastes, inks, solder and other residues left behind in the SMT process. Also recommended for tape drives, tape heads and PCBs.

Customer added value

  • Rapid evaporation
  • Non-woven, resistant material
  • Protection against contamination through storage in a can
  • Suitable for manual PCB cleaning
  • Wide range of applications
  • Disinfecting effect

Packaging units

Extras: 130 wipes per dispenser (200 mm x 200 mm)
Product information: PreWipe IPA/DI wipes