"As the trend towards the use of BGAs and other flip-chip components continues to grow, the demand for underfill materials is rising sharply. For this reason, our Belgian partner Roartis has decided to expand this segment," says Markus Geßner, Head of Marketing and Sales at Emil Otto GmbH. Emil Otto has added these three new underfillers to its range.
The IQ-Bond 2409-LV underfiller is a black, low-viscosity underfiller for large-volume applications. Unlike many other materials that require freezer storage and expensive dry ice shipping, IQ-BOND 2409-LV does not. IQ-BOND 2409-LV can be stored in the refrigerator and does not require frozen transportation solutions. This offers a significant reduction in logistics costs. The IQ-BOND 2409-LV is suitable for underfilling fine gaps and, as it has been designed for high volume applications, offers a fast curing cycle. Typical applications include the underfilling of CSP.
Another underfiller is IQ-BOND 2473-LV. The underfiller is also black, has a very low viscosity and is ideal for flow under large BGA components. IQ-BOND 2473-LV has been qualified for various automotive and industrial applications in which large BGAs have to be underfilled in a short time and with high throughput. Similar to IQ-BOND 2409-LV, IQ-BOND 2473-LV does not require freeze transportation. IQ-BOND 2473-LV can also be post-processed at high temperatures if required.
The portfolio is rounded off by the black underfiller IQ-BOND 2481, a high-performance material specially developed for high-temperature applications above 200°C to achieve a high Tg (> 230°C) in combination with a low CTE (<20 ppm). This makes it an ideal solution for underfilling BGAs, CSPs and other electronic components that are exposed to many temperature changes, for example in extremely harsh environments, and need to be protected in the process.
All underfillers can be obtained from Emil Otto on request. The same applies to the technical documentation.