No clean, alcohol-based flux, synthetic resin, di-carboxylic
acids, halogen-free (WEEE/RoHS compliant)
ISO-9454: 1231 // DIN EN 61190-1-1: L0 (REL0)
|Application area:||Wave- and selective soldering, manual- and repair soldering, dip soldering|
|Appearance/smell:||colorless to light yellow, clear|
|Solids content:||4.0 Gew.-% (wt.-%)|
|Density at 20 °C:||0.796 (+/-0.004) g/ml|
|Acid number:||32–35 mg KOH/g|
|Activators:||di-carboxylic acids, low resin content|
|Flash point:||12 °C|
At 4%, EO-B-008 has a high solids content. EO-B-008 was especially developed for short wave-soldering systems where the circuit board spends dwell time in the preheating phase. The subsequent soldering procedure occurs in a very active wave. Thanks to EO-B-008, the assembled printed circuit board shows very good soldering results with a very clean surface after the soldering procedure.
Customer added value:
Questions about our products?
We will advise you by phone 06123 / 7046-0.