Multi-Flux Special Flux for wave-, selective-, hand-soldering
DIN EN-61190-1-1 (acc. J-STD-004) / IEC: REL0
ISO-9454: 1231 (1.2.3.A) NO CLEAN
|Application area:||Wave-, selective- and manual soldering processes, as well as cable assembly|
|Appearance/smell:||transparent, yellowish - amber liquid|
|Solids content:||14,8 – 15,2 Gew.-% (wt.-%)|
|Density at 20 °C:||0,81 – 0,83 g/ml|
|Acid number:||40 - 46 mg KOH/g|
|Activators:||resin-carboxylic and dicarboxylic acids- complex|
|Solvents:||short chain alcohols|
|Flash point:||12 °C|
|Storage (recommendation):||store at 5-25 ° C, dry, sealed|
EO-B-023E is an NO CLEAN, specially developed for the REWORK-, HAND SOLDERING- and SELECTIVE SOLDERING – PROCESSES. Accordingly, it contains organic, halogen-free activating additives with resin in a combination specially tuned to the thermal requirements of the soldering processes. EO-B-023E can be applied by brushing, spraying, dipping etc.. The solids content is 15% by weight.
EO-B-023E is totally free from corrosion action.
Additional information on the ingredients (hazardous substances), safe handling, storage, transport and disposal can be found in the current safety data sheet (SDS, SDS, MSDS).
Instructions for use:
This flux is very versatile and OSP-compatible. Both in manual and selective soldering and in cable assembly/strand tinning good results. The general rule amounts of flux applied basically choosing as low as possible also applies to this product.
The density of the flux must be checked regularly. As the flux gradually evaporates in all application methods, the concentration increases during processing. At least at a density of 0.845, the solvent loss must be compensated, apart from exceptions, it is advisable to make this correction already at a density of 0.84. Our Flux Thinner “K-113” (cat.-no. 1003) is available as a suitable product for this purpose.
Questions about our products?
We will advise you by phone 06123 / 7046-0.