Low-solid flux specially developed for selective
soldering processes without halogenated activators
Type 2.2.3.A according to ISO 9454
Application area: | Manual- and repair soldering |
Appearance/smell: | Colorless, yellowish colored, clear fluid |
Solids content: | 3.5 Gew.-% |
Density at 20 °C: | 0.797 (+/- 0.003) g/ml |
Acid number: | 24–27 mg KOH/g |
Activators: | di-carboxylic acids |
Solvents: | Alcohol mixture |
Flash point °C: | 12 |
The EO Flux-Pen allows spot-on application of flux on PCBs. EO Flux-Pen consists of a cartouche- a special pressure dosing system with felt tip and a closing cap. The flux is kept in the cartouche and is applied with the felt tip. The special pressure dosing system allows thorough, pointed flux-application.
This low-solid flux has been developed specially for wave- and selective-soldering processes. The EO-Flux Pen FA-4004 can be applied via dip, stamp, or drop-jet application. Despite the low solid content of 3.5%, adequate activity is achieved, even for lead-free solders. Furthermore, the EO-Flux Pen FA-4004 contains a corrosion inhibitor.
Customer added value
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