Flux paste for electronics with halogen-free activators
ISO-9454: 1231 (1.2.3.C) // DIN EN 61190-1-1 // J-STD-004: REL0
|Application area:||Manual-, repair- and dip soldering, special applications, suitable for SMD-components as well as SnPb and Pb-free alloys|
|Appearance/smell:||pasty, amber, opaque, waxy, mild|
|Solids content:||very high Gew.-%|
|Density at 20 °C:||0.9–1.0 g/ml|
|Activators:||di-carboxylic acids, synthetic resin, halogen-free|
|Flash point °C:||>80|
|Viscosity (DIN 51810-1):||high|
The flux paste EO-FP-002 was specially developed for repair work on printed circuit boards and is characterised by high activity and very good wetting and spreading behaviour. Due to these properties, the paste is extremely economical to dose. The paste is applied via plastic tips, which enable precise dosing and positioning of the paste and offer the advantage over steel needles that the printed circuit boards cannot be scratched. The flux paste can be processed with hot air- and soldering irons.
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