No clean rework paste for the electronics with metal alloy component, (SAC 305),
lead-free and halogen-free activators. (WEEE/RoHS-compliant)
Type ROL0 acc. ANSI/J-STD-004 (IPC-TM-650)
|Application area:||Repair work on circuit boards, tinning of components|
These rework paste (lead-free) with metal alloy component [Sn 96.5 Ag 3.0 Cu 0.5] (>85%) have been developed for repair work on circuit boards
and components and are distinguished, among other things, by a high level of activity as well as good wetting and spread.
Due to these properties the paste should be applied sparingly. The paste is applied with a dosing syringe via a metal dosing needle.
This enables a precise dosing resp. positioning of the paste.
The processing of the rework paste can be carried out using hot-air or soldering iron.
Customer added value:
In individual cases, which must be checked by the user, the wave soldering of critical components can also be supported with this paste.
The paste is applied as described.
Questions about our products?
We will advise you by phone 06123 / 7046-0.