Otto's Original - Quality products since 1901
Flux

EO-Y-006C

Alcohol-based, partially aqueous flux, activated halogen-free,
with synthetic resin. (rosin-free)
(WEEE/RoHS-compliant, (LOW VOC), IPC: DIN EN 61190-1-1:
((IEC OR/L0) or type 2231 (2.2.3.A) acc. ISO 9454))

Packaging units:
Canisters with 5 and 20 liters – larger containers also available
Application area: Wave- and selective soldering
Appearance/smell: colorless-transparent liquid
Solids content: 3.9-4,2 Gew.-% (wt.-%)
Density at 20 °C: 0.86–0.88 g/ml
Acid number: 24–27 mg KOH/g
Activators: di-carboxylic acids, synthetic resin
Solvents: alcohol- / partial water-based
Flash point: 12 °C
Additive: wetting agent, alcohol combination <60%
VOC: 60 %
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Description

EO-Y-006C is universally suitable for the wave- and selective soldering of circuit boards and contains organic, halogen-free, activating additives formulated with a small amount of synthetic resin. This flux was developed in a combination with lead- and lead-free solders, coordinated especially to the thermal requirements of the soldering process.

EO-Y-006C contains special alcoholic additives for the stabilization and improvement of the drying time in comparison with conventional water- or partially water-based fluxes.

Recommendations for the processing of this flux:

This flux is very versatile in use and OSP-compatible. Good results are achieved with manual-, wave- and selective soldering as well as for cable manufacture/strand tinning. The generally applicable rule, to basically select as little of the applied flux as possible, is also valid for this product.

Foam fluxes: Not recommended

Spray fluxes: With the possibility of dosing the amount of fluxing agent, first set to 30–40 ml/min., observe the even distribution of flux on the circuit board (if necessary test with heat-sensitive paper) and then adjust to the optimal amount.

Pre-heating: With “simple” circuit boards a pre-heating temperature of 80–110 °C is recommended on the top side of the circuit board, with “more complex” boards a temperature of 100–130 °C is recommended. The operation can be carried out both in solder systems containing lead as well as lead-free solder systems.

 

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